Job Responsibilities:
  • Self-sufficient to develop system-level thermal solutions for power electronics applications, such as base station, brick converters, power packages, etc.;
  • To undertake thermal and structure design and analysis for power semiconductors and power systems;
  • To conduct tests for the characterization of packaging-related materials according to different application scenarios;
  • To build-up material; database.
 Requirements:
  • Master 's degree or above in Thermal / Mechanical Engineering, Materials, Physics, or related disciplines;
  • 3+ years industrial experiences in thermal/mechanical design for micro/power electronics for Master's Degree and less experience for PhD;
  • Proficient om thermal and structural design for power electronic package/systems with hands on experience in numerical modeling & simulation, materials selection, and reliability analysis;
  • Skilled with FEM/CFD simulation software such as ABAQUS, ANSYS, ICEPAK, Flotherm, FlowSim, etc.;
  • Familiar with 3D design & modeling tools, such as Solidworks, AutoCAD etc.; Knowledge on DoE, DFM/DFR is a plus;
  • Fluent in English, good written and oral communication skills; Strong team spirit and interpersonal skills; Independent, responsible, aggressive and outgoing character.